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Description
Datasheet Apr 7, 2014 FG256 /FGG256 Fine-Pitch BGA Package . XC2V1000 .. Wire-bond packages CS144, FG256 , FG456, FG676, BG575, and BG728 are also Jul 15, 2005 The XC2V4000, XC2V6000, and XC2V1000 are manufactured using a 0.15 1.5/ 3.3V 8-layer metal process . X0194LT XC2V1000 FG256 . XC2V1000 . 432. XC2V1500. 528. XC2V2000 XC2VP125. Package. Virtex-II Pro Packages with Available. RocketIO Transceiver Blocks. 4. FG256 . 4. 4. FG456. XC2V1000 number of user I/Os for that package and device combination, I/Os for RocketIO MGTs are not included in this table. I/Os. Package. FG256 . 4. 4. 2005 7 15 XC2V4000 XC2V6000 XC2V1000 UMC 12 . . /. . . X0194LT XC2V1000 . FG256 .
| Part Number | XC2V1000FG256I |
| Brand | Xilinx |
| Image |  |
XC2V1000FG256I
XILIINX
3255
0.53
Hong Kong Boyue Century Electronic Technology Co., Limited
XC2V1000FG256I
XILINX/
3255
1.4425
Cheng Yu Xiang Trading Sdn Bhd
XC2V1000-4FF896C
XILINXI
487
2.355
Risetech Technology (HK) Limited
XC2V1000-4BG575C
XILINX
100
3.2675
RX ELECTRONICS LIMITED
XC2V1000-4FF896C
Xilinx Inc.
112
4.18
HK TWO L ELECTRONIC LIMITED
