Xilinx

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Xilinx is the inventor of the FPGA, programmable SoCs, and now, the ACAP. Our highly-flexible programmable silicon, enabled by a suite of advanced software and tools, drives rapid innovation across a wide span of industries and technologies - from consumer to cars to the cloud. Xilinx delivers the most dynamic processing technology in the industry, enabling rapid innovation with its adaptable, intelligent computing.

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Description

Jun 12, 2014 Table 1: Production Status of Spartan-3AN FPGAs. Spartan-3AN FPGA. Status. XC3S50AN. Production. XC3S200AN . Production. XC3S400AN. Aug 19, 2010 DS529 August 19, 2010. 0. 0. Product Specification. Spartan-3A FPGA. Status. XC3S50A. Production. XC3S200A . Production. XC3S400A. Oct 20, 2008 This change is to standardize FT256 and FTG256 in the XC3S50A, XC3S200A / AN and XC3S400A to the current 2-layer substrate package May 5, 2014 XC3S200AN . FT(G)256. XC3S400AN. FT(G)256. FG(G)400. XC3S700AN. FG(G) 484. XC3S1400AN(2). FG(G)676. Notes: 1. Please refer to the FPGAs, order your hardware development board at www.xilinx.com/s3anstarter. Spartan-3AN FPGA Platform. Device. XC3S50AN. XC3S200AN . XC3S400AN.

Part Number XC3S200AN4FTG256C
Main Category Integrated Circuits (ICs)
Sub Category Embedded - FPGAs (Field Programmable Gate Array)
Brand Xilinx
Description IC FPGA 195 I/O 256FTBGA
Series Spartan-3AN
Number of LABs/CLBs 448
Number of Logic Elements/Cells 4032
Total RAM Bits 294912
Number of I/O 195
Number of Gates 200000
Voltage - Supply 1.14 V ~ 1.26 V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 256-LBGA
Supplier Device Package 256-FTBGA (17x17)
Image Integrated Circuits (ICs)
Lowest Price: $0.43   Highest Price: $3.1
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Xilinx Inc.

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1800

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