Description
IC SOC CORTEX-A9 KINTEX7 676FBGA Series: Zynq?-7000 Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? MCU Flash: - MCU RAM: 256KB Peripherals: DMA Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 667MHz Primary Attributes: Kintex?-7 FPGA, 350K Logic Cells Operating Temperature: 0~C ~ 85~C Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)
Part Number | XC7Z045-1FBG676CES |
Main Category | Integrated Circuits (ICs) |
Sub Category | Embedded - System On Chip (SoC) |
Brand | Xilinx |
Description | IC SOC CORTEX-A9 KINTEX7 676FBGA |
Series | Zynq-7000 |
Packaging | Tray |
Architecture | MCU, FPGA |
Core Processor | Dual ARM Cortex-A9 MPCore,with CoreSight,,-" |
MCU Flash | 256KB |
MCU RAM | DMA |
Peripherals | CAN, EBI/EMI, Ethernet, I²ÂC, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Connectivity | 667MHz |
Speed | Kintex,7 FPGA, 350K Logic Cells |
Primary Attributes | 0°C ~ 85°C (TJ) |
Operating Temperature | 676-BBGA, FCBGA |
Package / Case | 676-FCBGA (27x27) |
Supplier Device Package | |
Image |
XC7Z045-1FBG676CES
XILIINX
3000
0.73
Hong Kong New RD Core Electronics Co., Limited
XC7Z045-1FBG676CES
XILINX/
25860
1.8525
YU TUO (HONGKONG) TRADING CO., LIMITED
XC7Z045-1FBG676CES
XILINXI
2000
2.975
TENYU Electronics (HongKong) Co., Limited
XC7Z045-1FBG676CES
XILINX
120
4.0975
E-CORE COMPONENT CO., LIMITED
XC7Z045-1FBG676CES
Xilinx Inc.
3000
5.22
HONG KONG YUE JIN PENG ELECTRONICS CO.