Description
IC SOC CORTEX-A9 KINTEX7 900FBGA Series: Zynq?-7000 Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? MCU Flash: - MCU RAM: 256KB Peripherals: DMA Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 667MHz Primary Attributes: Kintex?-7 FPGA, 350K Logic Cells Operating Temperature: 0~C ~ 85~C Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)
Part Number | XC7Z045-1FFG900CES |
Main Category | Integrated Circuits (ICs) |
Sub Category | Embedded - System On Chip (SoC) |
Brand | Xilinx |
Description | IC SOC CORTEX-A9 KINTEX7 900FBGA |
Series | Zynq-7000 |
Packaging | Tray |
Architecture | MCU, FPGA |
Core Processor | Dual ARM Cortex-A9 MPCore,with CoreSight,,-" |
MCU Flash | 256KB |
MCU RAM | DMA |
Peripherals | CAN, EBI/EMI, Ethernet, I²ÂC, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Connectivity | 667MHz |
Speed | Kintex,7 FPGA, 350K Logic Cells |
Primary Attributes | 0°C ~ 85°C (TJ) |
Operating Temperature | 900-BBGA, FCBGA |
Package / Case | 900-FCBGA (31x31) |
Supplier Device Package | |
Image |
XC7Z045-1FFG900CES
XILIINX
3000
1.62
Hong Kong New RD Core Electronics Co., Limited
XC7Z045-1FFG900CES
XILINX/
1000
2.6025
HK HEQING ELECTRONICS LIMITED
XC7Z045-1FFG900CES
XILINXI
100000
3.585
FUSION ELECTRONICS LTD
XC7Z045-1FFG900CES
XILINX
5000
4.5675
Bostock HK Limited
XC7Z045-1FFG900CES
Xilinx Inc.
125
5.55
E-CORE COMPONENT CO., LIMITED