Part Number | XC7Z045-3FFV676E |
Main Category | Integrated Circuits (ICs) |
Sub Category | Embedded - System On Chip (SoC) |
Brand | Xilinx |
Description | IC FPGA |
Series | Zynq-7000 |
Packaging | Tray |
Architecture | MCU, FPGA |
Core Processor | Dual ARM Cortex-A9 MPCore,with CoreSight,,-" |
MCU Flash | 256KB |
MCU RAM | DMA |
Peripherals | CAN, EBI/EMI, Ethernet, I²ÂC, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Connectivity | 1GHz |
Speed | Kintex,7 FPGA, 350K Logic Cells |
Primary Attributes | 0°C ~ 100°C (TJ) |
Operating Temperature | 676-BBGA, FCBGA |
Package / Case | 676-FCBGA (27x27) |
Supplier Device Package | |
Image |
XC7Z045-3FFV676E
XILIINX
2773
1.47
TENYU Electronics (HongKong) Co., Limited
XC7Z045-3FFV676E
XILINX/
4642
2.8825
HK HEQING ELECTRONICS LIMITED
XC7Z045-3FFV676E
XILINXI
2680
4.295
Xian Neng Technology (Hongkong) International Limited
XC7Z045-3FFV676E
XILINX
9383
5.7075
HITO TECHNOLOGY LIMITED
XC7Z045-3FFV676E
Xilinx Inc.
1059
7.12
HONG KONG YUE JIN PENG ELECTRONICS CO.