Part Number | XCZU17EG-3FFVD1760E |
Main Category | Integrated Circuits (ICs) |
Sub Category | Embedded - System On Chip (SoC) |
Brand | Xilinx |
Description | IC FPGA 308 I/O 1760FCBGA |
Series | Zynq UltraScale+,MPSoC EG |
Packaging | Tray |
Architecture | MCU, FPGA |
Core Processor | Quad ARM Cortex-A53 MPCore,with CoreSight, Dual ARMCortex,R5 with CoreSight,,-" |
MCU Flash | 256KB |
MCU RAM | DMA, WDT |
Peripherals | CAN, EBI/EMI, Ethernet, I²ÂC, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Connectivity | 600MHz, 1.5GHz |
Speed | ZynqUltraScale+,FPGA, 926K+ Logic Cells |
Primary Attributes | 0°C ~ 100°C (TJ) |
Operating Temperature | 1760-BBGA, FCBGA |
Package / Case | 1760-FCBGA (42.5x42.5) |
Supplier Device Package | |
Image |
XCZU17EG-3FFVD1760E
XILIINX
2000
1.82
TENYU Electronics (HongKong) Co., Limited
XCZU17EG-3FFVD1760E
XILINX/
800
2.925
HK HEQING ELECTRONICS LIMITED
XCZU17EG-3FFVD1760E
XILINXI
85
4.03
Xian Neng Technology (Hongkong) International Limited
XCZU17EG-3FFVD1760E
XILINX
3000
5.135
HONG KONG YUE JIN PENG ELECTRONICS CO.
XCZU17EG-3FFVD1760E
Xilinx Inc.
11001
6.24
N&S Electronic Co., Limited