Part Number | XCZU19EG-1FFVC1760E |
Main Category | Integrated Circuits (ICs) |
Sub Category | Embedded - System On Chip (SoC) |
Brand | Xilinx |
Description | IC FPGA 512 I/O 1760FCBGA |
Series | Zynq UltraScale+,MPSoC EG |
Packaging | Tray |
Architecture | MCU, FPGA |
Core Processor | Quad ARM Cortex-A53 MPCore,with CoreSight, Dual ARMCortex,R5 with CoreSight,,-" |
MCU Flash | 256KB |
MCU RAM | DMA, WDT |
Peripherals | CAN, EBI/EMI, Ethernet, I²ÂC, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Connectivity | 600MHz, 1.5GHz |
Speed | ZynqUltraScale+,FPGA, 1143K+ Logic Cells |
Primary Attributes | 0°C ~ 100°C (TJ) |
Operating Temperature | 1760-BBGA, FCBGA |
Package / Case | 1760-FCBGA (42.5x42.5) |
Supplier Device Package | |
Image |
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XCZU19EG-1FFVC1760E
XILINX
3358
1.9725
ENSPIRE TECHNOLOGY (HONG KONG) CO., LIMITED
XCZU19EG-1FFVC1760E
Xilinx Inc.
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2.62
Oking (Hongkong) Electronic Limited
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HITO TECHNOLOGY LIMITED
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0.6775
CIS Ltd (CHECK IC SOLUTION LIMITED)
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Shenzhen Haoxinsheng Technology Co., Ltd.