Part Number | XCZU19EG-L2FFVD1760E |
Main Category | Integrated Circuits (ICs) |
Sub Category | Embedded - System On Chip (SoC) |
Brand | Xilinx |
Description | IC FPGA 308 I/O 1760FCBGA |
Series | Zynq UltraScale+,MPSoC EG |
Packaging | Tray |
Architecture | MCU, FPGA |
Core Processor | Quad ARM Cortex-A53 MPCore,with CoreSight, Dual ARMCortex,R5 with CoreSight,,-" |
MCU Flash | 256KB |
MCU RAM | DMA, WDT |
Peripherals | CAN, EBI/EMI, Ethernet, I²ÂC, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Connectivity | 600MHz, 1.5GHz |
Speed | ZynqUltraScale+,FPGA, 1143K+ Logic Cells |
Primary Attributes | 0°C ~ 100°C (TJ) |
Operating Temperature | 1760-BBGA, FCBGA |
Package / Case | 1760-FCBGA (42.5x42.5) |
Supplier Device Package | |
Image |
XCZU19EG-L2FFVD1760E
XILIINX
7476
1.68
HONG KONG IFUSON TECHNOLOGY CO., LIMITED
XCZU19EG-L2FFVD1760E
XILINX/
7394
2.81
Hong Kong One Core Century Technology Co., Limited
XCZU19EG-L2FFVD1760E
XILINXI
3242
3.94
Xian Neng Technology (Hongkong) International Limited
XCZU19EG-L2FFVD1760E
XILINX
1046
5.07
Hong Kong YST Electronics Co., Limited
XCZU19EG-L2FFVD1760E
Xilinx Inc.
6422
6.2
TENYU Electronics (HongKong) Co., Limited